Aim 688 One-Step Underfill (10 Units)

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New $90.00 (tax included) Number of stocks: 1

Used $45.00 (tax included) New Arrivals and Restocks Number in stock: 1

$45.00 cheaper than the new price!!

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New $90.00

Management number	204120156	Release Date	2025/11/05	List Price	$45.00	Model Number	204120156
Category	Brands A–C

A non-odorous, low surface tension, one component epoxy resin designed as a one-step underfill for flip chip, CSP, BGA and uBGA assemblies. Available in industry standard sizes.

Excellent Capillary Function for Fast Reflow Compatible with No-Clean Flux Residues Odorless During Printing and Curing Flux Action to Make Solder Connections Non-Hygroscopic Reworkable Good Storage Properties No Voiding Cures in Lead-Free Profile .
TDS
MSDS